Title: Mechanism of TCO thin film removal process using near-infrared ns pulse laser Plasma shielding effect on irradiation direction Authors: Kim, B. Iida, R. Doan, H.D. Fushinobu, K. Keywords: Laser ablation;Nanosecond laser scribing;Plasma shielding;Transparent conductive oxide thin film Issue Date: 2016 Publisher: Elsevier Ltd Citation: Scopus Abstract: Substrate side irradiation is widely used for a thin film removal process because high absorption at the film/substrate or film/film interface leads to complete isolation of thin film by single shot irradiation of laser pulse with low energy. However, in the transparent thin film removal process, large thermal expansion or local phase change at the interface cannot be created by substrate side irradiation because of its large optical penetration depth compared to its small thickness. Nevertheless, substrate side irradiation works obviously for single shot film isolation proces...
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